Technical specifications for the SONOFF "P" model confirm the use of the Texas Instruments CC2652P chipset. This wireless MCU includes an integrated +20dBm power amplifier and comes pre-flashed with Z-Stack 3.x.0 coordinator firmware. Material analysis reveals an aluminum alloy housing that functions as a heat sink for the radio module during high-traffic mesh operations, supporting up to 50 direct child devices and over 200 mesh nodes.
The hardware is a raw radio coordinator requiring a host machine such as a Raspberry Pi to execute automation logic. Signal integrity is compromised by USB 3.0 ports; standardized testing indicates a 1-meter USB 2.0 extension is necessary to isolate the radio from host-generated EMI. The device operates entirely locally with Zigbee2MQTT or ZHA, ensuring zero cloud dependency for home automation control.
- Chipset: Texas Instruments CC2652P (+20dBm amplifier).
- Housing: Aluminum alloy for thermal management.
- Protocol: Zigbee 3.0 (Z-Stack 3.x.0).
- Connectivity: USB-A interface with external 2dBi antenna.
We recommend pairing this coordinator with a reliable open-source hub kit to run your automation logic locally.
The SONOFF Dongle-P provides an alternative to the "E" variant for users who prefer the Texas Instruments chipset architecture for their Zigbee coordinator.
